​Procuring and managing thin devices can be challenging. American Semiconductor has the capability to provide thin devices in any target thickness. Additionally, we provide thin die in small volumes which is critical for R&D and prototyping programs.  

In addition to FleX-ICs, American Semiconductor can supply conventional thin-devices for customers that need ICs not yet available in FleX technology. American Semiconductor’s advanced grind capability can support wafers as thin as 5 um. Thinning for 200mm wafers is immediately available and 300mm support is in development.