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Thin Device Supply

Small quantity thin-device availability can be challenging for new projects. American Semiconductor maintains an inventory of SoP packaged ICs that can be used for product development, evaluations and feasibility projects. Current inventory includes a variety of ultra-thin SoP chips from leading manufacturers such as Nordic, EM Microelectronic, NXP and Cypress, with capability for SOC, RFID, NFC and BLE®.

Small lot SoP CSP processing and test is available for customers that wish to produce evaluation quantities of new thin devices prior to volume production.
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Contact sales@americansemi.com for current inventory availability or small lot processing.
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​American Semiconductor, Inc               
6987 W. Targee Street 
Boise, Idaho 83709
​                                      

Office 208.336.2773

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  • Home
  • Products
    • FleX-ICs
    • FHE Development Kits >
      • Thin and Flexible Bluetooth™ Development Kit
      • FleX-NFC Starter Kit
      • FleX-ADC Development Kit
    • Smart Labels >
      • Data Logger Labels
      • Smart Tags
  • Services
    • SoP Packaging
    • Assembly & Test
    • FHE Design & Integration
  • Tech
    • Presentations
    • Videos
    • Papers & Articles
  • About
    • About ASI
    • Investors
    • Registered Users
  • News
  • Careers
  • Contact