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Semiconductor-on-Polymer™ Chip Scale Packaging 

American Semiconductor offers FleX-C Silicon-on-Polymer (SoP) WLCSP processing and technology to produce the thinnest CSP ICs possible. FleX-C is a 2-sided protected SoP CSP process that produces ultra-thin ICs from IDM or foundry wafers. FleX-C processing can be applied to any 200mm or 300mm silicon wafer, whether bulk or SOI. 
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SoP technology makes the thinnest chips possible

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SoP is an advanced packaging process
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​American Semiconductor, Inc               
6987 W. Targee Street 
Boise, Idaho 83709
​                                      

Office 208.336.2773

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  • Home
  • Products
    • FleX-ICs
    • FHE Development Kits >
      • Thin and Flexible Bluetooth™ Development Kit
      • FleX-NFC Starter Kit
      • FleX-ADC Development Kit
    • Smart Labels >
      • Data Logger Labels
      • Smart Tags
  • Services
    • SoP Packaging
    • Assembly & Test
    • FHE Design & Integration
  • Tech
    • Presentations
    • Videos
    • Papers & Articles
  • About
    • About ASI
    • Investors
    • Registered Users
  • News
  • Careers
  • Contact