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American Semiconductor offers FleX-C Silicon-on-Polymer (SoP) WLCSP processing and technology to produce the thinnest CSP ICs possible. FleX-C is a 2-sided protected SoP CSP process that produces ultra-thin ICs from IDM or foundry wafers. FleX-C processing can be applied to any 200mm or 300mm silicon wafer, whether bulk or SOI.
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SoP technology makes the thinnest chips possible
