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Smart Labels

Picture
American Semiconductor is not a smart-label or data-logger company. However, SoP packaged ICs and flip-chip ACA thin device assemblies have been demonstrated as ideal for smart label and data-logger applications.  American Semiconductor has designed and produced well characterized reference designs and label technology demonstrators that can be used to jump start “smart” product solutions in IoT, logistics, tracking and similar uses.
  • Data-loggers: American Semiconductor data-logger labels demonstrate advanced flexible electronic systems enabled with FleX-NFC SOCs with temperature sensor, printed antenna inlays and small format flexible batteries (see below)
  • Smart-Labels: American Semiconductor smart-labels demonstrate energy harvesting NFC or EPC Gen2 RFID technology that requires no on-board power source and provides unique consumer interactive experiences for consumer feedback, on-line ordering, product authentication and security (see below) 
RFID Temperature Sensor label
  • UHF (902-928 MHz)
  • Passive Power (from reader)
  • EPC Gen 2 (ISO 18000-6C)
  • -40'C to 60C +/- 2'C
  • ~8ft Range
  • 4" x 1" LabelSize
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​American Semiconductor, Inc               
6987 W. Targee Street 
Boise, Idaho 83709
​                                      

Office 208.336.2773

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© COPYRIGHT 2021 American Semiconductor, Inc. ALL RIGHTS RESERVED.
  • Home
  • Products
    • FleX-ICs
    • FHE Development Kits >
      • Thin and Flexible Bluetooth™ Development Kit
      • FleX-NFC Starter Kit
      • FleX-ADC Development Kit
    • Smart Labels >
      • Data Logger Labels
      • Smart Tags
  • Services
    • SoP Packaging
    • Assembly & Test
    • FHE Design & Integration
  • Tech
    • Presentations
    • Videos
    • Papers & Articles
  • About
    • About ASI
    • Investors
    • Registered Users
  • News
  • Careers
  • Contact