Design & Integration

Design & Integration

Design & Integration American Semiconductor provides Design and Integration services for Flexible Hybrid Electronics including: Flexible Circuit Board (FCB) Design & Layout IC design support (specific to new pad layouts and optimization for packaging) FCB...
Semiconductor-on-Polymer™ Chip Scale Packaging

Semiconductor-on-Polymer™ Chip Scale Packaging

Semiconductor-on-Polymer™ Chip Scale Packaging  Semiconductor-on-Polymer (SoP™) Protected-WLCSP, aka P-WLCSP, is an advanced CSP process for 200mm and 300mm wafers. The FleX-C SoP process can be used to protect two sides of the die. The SoP-TM process can fully encase...
Assembly

Assembly

Assembly American Semiconductor provides Assembly services for SoP, thin-device technology, and SMT supporting product development and pilot production volumes.American Semiconductor ACA Flip-chip assembly is a high-density anisotropic conductive adhesive “direct...
Wafer Test

Wafer Test

​Wafer Test American Semiconductor provides Test services for wafer, package and system level applications. Digital and Mixed signal testing are available at wafer level for pre and post wafer level processing and packaging. This includes automated test capability for...
System & Reliability Testing

System & Reliability Testing

​Flex Assembly Testing Chip-on-flex – SoP/SMT on board testing FHE – Flexible Hybrid System Function and Reliability Chip-on-flex and FHE systems require evaluation to ensure manufacturing methods and that functional products are being shipped to customers....