Advanced Packaging
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
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Polymer Enabled Ultra-thin Package solutions for Heterogeneous, package-in-package and embedded ICs
DPC 2020
Ultra-Thin Wafer-Level Chip Scale PackagingIMAPS 2019 Boston
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SEMICONDUCTOR-ON-POLYMER (SoP™) THE EVOLUTION OF THIN IC PACKAGING
IWLPC 2019
Advanced Flexible Hybrid Electronic (FHE) DemonstratorsPrinted Electronics USA 2018Complex Flexible Hybrid Electronic Labels
FleX 2018
Flexible Smart Asset MonitorFleX 2017
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Opportunities and Challenges for Thin MEMS Sensor SystemMEMS & SENSORS Executive Congress 2018FHE System for Touch and Gesture
FleX 2018
Advances in FHE ReliabilityFleX 2017
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Physically Flexible SoCFleX 2017
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Advances in FHE ReliabilityLoPEC 2017
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System Design & ReliabilitySEMICON 2016
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Advances in FHE IntegrationFleX 2016
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Enabling Flexible ElectronicsOrganic Electronics Association Workshop 2016
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FHE Integration & ManufacturingPrinted Electronics USA 2015
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