Advanced Packaging

Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
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IMAPS 2020

Revolutionary Tech for Thin Devices

CES 2020

Polymer Enabled Ultra-thin Package solutions for Heterogeneous, package-in-package and embedded ICs

DPC 2020

Ultra-Thin Wafer-Level Chip Scale Packaging

IMAPS 2019 Boston

SEMICONDUCTOR-ON-POLYMER (SoP™) THE EVOLUTION OF THIN IC PACKAGING

IWLPC 2019

Advanced Flexible Hybrid Electronic (FHE) Demonstrators

Printed Electronics USA 2018

Complex Flexible Hybrid Electronic Labels

FleX 2018

Flexible Smart Asset Monitor

FleX 2017

Opportunities and Challenges for Thin MEMS Sensor System

MEMS & SENSORS Executive Congress 2018

FHE System for Touch and Gesture

FleX 2018

Advances in FHE Reliability

FleX 2017

Physically Flexible SoC

FleX 2017

Advances in FHE Reliability

LoPEC 2017

System Design & Reliability

SEMICON 2016

Advances in FHE Integration

FleX 2016

Enabling Flexible Electronics

Organic Electronics Association Workshop 2016

FHE Integration & Manufacturing

Printed Electronics USA 2015