Counterfeit Vaccines are proliferating and threaten to undermine the Covid-19 rollout
American Semiconductor White Paper
January 2021

Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Douglas Hackler, Edward Prack
IMAPS, 2020

Semiconductor-on-Polymer Wafer Level Chip Scale Packaging
Douglas Hackler, Dale Wilson, Edward Prack
Device Packaging Conference, March 2019

Flexible Hybrid Electronics (FHE) Assembly Using Low-Temp Solder on PET
Brian Meek, Dale Wilson
White paper, August 2018

Flexible Hybrid Electronics: System Design & Reliability
Rich Chaney, Doug Hackler, Dale Wilson
SEMICON West, July 2016

Electromechanical Reliability Testing of Flexible Hybrid Electronics Incorporating FleX Silicon-on-Polymer ICs
Darrell E. Leber, Brian N. Meek, Seth D. Leija, Dale G. Wilson, Richard L. Chaney, Douglas R. Hackler
IEEE WMED Conference Proceedings, pp38-41, April 2016

Advances in FHE Integration using FleXform-ADC
Rich Chaney, Doug Hackler, Dale Wilson
2016FLEX Conference, March 2016

FHE Integration & Manufacturing for Killer Apps
Doug Hackler
IDTechEx Printed Electronics, November 2015

Solving Integration Challenges for Flexible Hybrid Electronics
Richard Chaney
Nano for Defense Conference, November 2015

Solving Integration Challenges for Printed and Flexible Hybrid Electronics
Richard Chaney
SEMICON West, July 2015

Flexible Hybrid Electronics Solutions for Wearable Sensor Systems
Richard Chaney
2015FLEX Conference, February 2015

Solving Integration Challenges for Flexible Hybrid Electronics
Doug Hackler
2015FLEX Conference, February 2015

Enabling Flexible Hybrid Electronics with The FleXform™ Development Kit
Richard L. Chaney, Douglas R. Hackler, Dale G. Wilson
SEMICON West, July 2014

Universal Flexible Hybrid System Development Kit Including MCU, ADC, and RFIC
Doug Hackler
CMOSETR, July 2014

FleX™ Silicon-on-Polymer™ Flexible Single Crystalline ICs from Commercial Foundry Processes for Flexible Hybrid Systems
Doug Hackler
LOPEC, May 2014

Physically Flexible High Performance Single Crystal CMOS Integrated with Printed Electronics
Richard L. Chaney, Douglas R. Hackler, Dale G. Wilson, Brian N. Meek
IEEE WMED Conference Proceedings, pp28-31, April 2014

Flexible Product Demonstrations Enabled with the FleX™ IC Development Kit
Doug Hackler
2014FLEX Conference, February 2014

Enabling Electronic Devices, Materials, and Processes with Physically Flexible ICs
Rich Chaney
2014FLEX Conference, February 2014

Role of Conventional Silicon ICs in Flexible Electronics
Douglas R. Hackler Sr., Richard L. Chaney, Dale G. Wilson
SEMICON West, July  2013

FleX Silicon-on-Polymer: Flexible (Pliable) ICs from Commercial Foundry Processes
Richard L. Chaney, Douglas R. Hackler Sr., Dale G. Wilson, Brian N. Meek
GOMAC, March 2013

Advanced Conformal Load-Bearing Antenna Structures
Richard L. Chaney, Douglas R. Hackler Sr., Dale G. Wilson, Brian N. Meek
GOMAC, March 2013

FleX™ Silicon-on-Polymer™: Flexible ICs from Commercial Foundry Processes
Doug Hackler, Rich Chaney, Dale Wilson, Brian Meek
2013FLEX Conference, January 2013

Flexible Hybrid Systems in Conformal Load-Bearing Antenna Structures
Rich Chaney, Doug  Hackler, Dale Wilson, Brian Meek
2013FLEX Conference, January 2013

Flexible Hybrid Systems: High Performance CMOS with Printed Electronics
Richard Chaney
DMC, November 2012

Pliable Smart Sensor System
Doug Hackler, Rich Chaney, Dale Wilson
2012FLEX Flexible Electronics & Displays Conference, February 2011

High Performance Single Crystal CMOS on Flexible Polymer Substrate
Richard L. Chaney, Douglas R. Hackler
GOMAC, March 2011

High Performance Electronics Integration in Flexible Technology
Douglas R. Hackler
2011FLEX (Flexible Electronics and Displays Conference), February 2011

Performance Electronics Integration in Flexible Technology
Richard L. Chaney, Douglas R. Hackler
GOMAC, March 2010