San Jose, July 18, 2018 - NextFlex Lauds American Semiconductor as Game Changers in Flexible Hybrid Electronics
Through delivery of Flexible Smart Asset Monitor and Tracking Tag
American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been honored by comments from NextFlex’s Director of Technology, Jason Marsh. “American Semiconductor’s leadership on the NextFlex-funded project – Flexible Smart Asset Monitor and Tracking Tag – along with partner Boise State University, recently resulted in delivery of completed demonstrators that prove that this game-changing flexible technology has advanced substantially. This new smart sensor tag utilizes long range RFID, can monitor temperature in real-time, includes an on-board battery, and due to its flexible form factor, it can repeatedly bend to 10mm in a radius bend test,” said Jason Marsh, NextFlex Director of Technology. “This is a great demonstration of print process applications for the packaging industry, particularly for pharma cold-chain. American Semiconductor’s talented team of engineers are advancing flexible hybrid electronics, and this smart asset tag illustrates how flexible hybrid electronics (FHE) can add value to supply chain management systems that reduce waste and improve quality time to market.”
Richard Ellinger, Vice President of Sales and Marketing noted, “Flexible Hybrid Electronics are exploding in the market after gaining traction over the last 12 months. In 2019, FHEs will begin to appear in commercial and consumer applications and will become ubiquitous in our everyday lives by 2022. Today is just the beginning of the FHE market – and all of us at American Semiconductor are very excited to help enable this new age of electronics.”
Through delivery of Flexible Smart Asset Monitor and Tracking Tag
American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been honored by comments from NextFlex’s Director of Technology, Jason Marsh. “American Semiconductor’s leadership on the NextFlex-funded project – Flexible Smart Asset Monitor and Tracking Tag – along with partner Boise State University, recently resulted in delivery of completed demonstrators that prove that this game-changing flexible technology has advanced substantially. This new smart sensor tag utilizes long range RFID, can monitor temperature in real-time, includes an on-board battery, and due to its flexible form factor, it can repeatedly bend to 10mm in a radius bend test,” said Jason Marsh, NextFlex Director of Technology. “This is a great demonstration of print process applications for the packaging industry, particularly for pharma cold-chain. American Semiconductor’s talented team of engineers are advancing flexible hybrid electronics, and this smart asset tag illustrates how flexible hybrid electronics (FHE) can add value to supply chain management systems that reduce waste and improve quality time to market.”
Richard Ellinger, Vice President of Sales and Marketing noted, “Flexible Hybrid Electronics are exploding in the market after gaining traction over the last 12 months. In 2019, FHEs will begin to appear in commercial and consumer applications and will become ubiquitous in our everyday lives by 2022. Today is just the beginning of the FHE market – and all of us at American Semiconductor are very excited to help enable this new age of electronics.”
Nov 15, 2017: American Semiconductor, Inc. today announced IDTechEx has awarded the company with the 2017 Best New Wearable Component at the IDTechEx USA Show in Santa Clara, CA.
American Semiconductor converted Cypress Semiconductor’s PSoC® microcontroller (MCU) wafers into physically flexible Semiconductor-on-Polymer (SoP) with silicon thicknesses less than 5 um. The new FleX-SOC™ is a functioning version of the Cypress part attached to a flexible substrate that can contour to the body for wearable electronics applications. The PSoC device integrates an MCU core, programmable analog circuitry and digital logic, and Cypress’ industry-leading CapSense® capacitive touch-sensing technology, making it ideal to address a range of wearable electronics applications.
“Having the flexible design capabilities of PSoC in the ultra-thin FleX-SOC form factor provides developers with the ability to use chips in ways we could only dream about in the past. We are partnering with American Semiconductor to provide this FleX-SOC to the market immediately,” said John Weil, Cypress Semiconductor Vice President and GM, MCU Business Unit.
“Our patented ultra-thin flexible SoP wafer conversion process is a new industry capability that is gaining tremendous traction. This ever-increasing recognition and use of our technology by the market is very exciting for us and our shareholders,” Doug Hackler, President and CEO of American Semiconductor, noted.
“American Semiconductor’s success is a testament to our ability to flex any standard wafer for use in flexible hybrid electronic systems. Our mission is to deliver affordable, technologically advanced flexible IC products and services that give our customers a competitive edge,” stated Richard Ellinger, Vice President of Sales and Marketing for American Semiconductor.
About American Semiconductor: American Semiconductor is the industry leader in high performance flexible integrated circuits (FleX™ IC’s) that bend like a sheet of paper to enable flexible hybrid electronics (FHE) for wearables, Internet of Things (IoT), smart-labels and smart-structure products. American Semiconductor supplies high-volume ICs converted into FleX, proprietary FleX-ICs and design integration services for systems using ultra-thin electronic chips. American Semiconductor offers a complete suite of product prototyping and demonstrator manufacturing services that enable customers to realize their flexible hybrid product solutions.
American Semiconductor converted Cypress Semiconductor’s PSoC® microcontroller (MCU) wafers into physically flexible Semiconductor-on-Polymer (SoP) with silicon thicknesses less than 5 um. The new FleX-SOC™ is a functioning version of the Cypress part attached to a flexible substrate that can contour to the body for wearable electronics applications. The PSoC device integrates an MCU core, programmable analog circuitry and digital logic, and Cypress’ industry-leading CapSense® capacitive touch-sensing technology, making it ideal to address a range of wearable electronics applications.
“Having the flexible design capabilities of PSoC in the ultra-thin FleX-SOC form factor provides developers with the ability to use chips in ways we could only dream about in the past. We are partnering with American Semiconductor to provide this FleX-SOC to the market immediately,” said John Weil, Cypress Semiconductor Vice President and GM, MCU Business Unit.
“Our patented ultra-thin flexible SoP wafer conversion process is a new industry capability that is gaining tremendous traction. This ever-increasing recognition and use of our technology by the market is very exciting for us and our shareholders,” Doug Hackler, President and CEO of American Semiconductor, noted.
“American Semiconductor’s success is a testament to our ability to flex any standard wafer for use in flexible hybrid electronic systems. Our mission is to deliver affordable, technologically advanced flexible IC products and services that give our customers a competitive edge,” stated Richard Ellinger, Vice President of Sales and Marketing for American Semiconductor.
About American Semiconductor: American Semiconductor is the industry leader in high performance flexible integrated circuits (FleX™ IC’s) that bend like a sheet of paper to enable flexible hybrid electronics (FHE) for wearables, Internet of Things (IoT), smart-labels and smart-structure products. American Semiconductor supplies high-volume ICs converted into FleX, proprietary FleX-ICs and design integration services for systems using ultra-thin electronic chips. American Semiconductor offers a complete suite of product prototyping and demonstrator manufacturing services that enable customers to realize their flexible hybrid product solutions.
Nov 1, 2017 – American Semiconductor to Exhibit at IDTechEx 2017 in Santa Clara, CA
Boise, ID – American Semiconductor announces they will exhibit at the IDTechEx Show November 15 & 16, 2017 in Santa Clara, California. The booth will be on "Demonstration Street" at the show and American Semiconductor is planning to present pSoC, NFC and RFID flex IC products.
Boise, ID – American Semiconductor announces they will exhibit at the IDTechEx Show November 15 & 16, 2017 in Santa Clara, California. The booth will be on "Demonstration Street" at the show and American Semiconductor is planning to present pSoC, NFC and RFID flex IC products.
September 21, 2017
Launched the world's first fully functional hybrid electronics demonstrator on Innovation Day at NextFlex! The FleX-SoC IC demonstrator has 2 capacitive touch sensors and 3 output LEDs.
Launched the world's first fully functional hybrid electronics demonstrator on Innovation Day at NextFlex! The FleX-SoC IC demonstrator has 2 capacitive touch sensors and 3 output LEDs.
Sept 11, 2017 – American Semiconductor Announces New Board Member
Boise, ID – American Semiconductor announces the appointment of Thomas Jensen to its Board of Directors. Mr. Jensen is a technologist and executive with a broad range of experience in areas of management at NIO and Tesla Motors, and in engineering roles at IDEO and Hewlett Packard. Thomas is well known as an early flexible electronics concept pioneer, and has founded three successful start-ups. His third success was with Paksense, Inc in 2004, where Thomas led the company to win a 2006 Wall Street Journal award for Best Technical Innovation and Idaho’s 2011 Innovative Company of the Year Award. He defined high-level architecture and the first toolsets for products at PakSense, and established the vision and strategy for launches into new markets that paved the way for the successful acquisition of the company in 2016 by Emerson. Thomas holds a BS, Computer Science degree from the University of Georgia and has a track record of technical innovation that includes 26 patents.
“Tom has agreed to serve on our board based on our shared vision of flexible hybrid electronics and our combined belief that the core technology to the explosive growth expected by all FHE market analysts lies within American Semiconductor’s core offering - flexible ICs. Jointly we believe American Semiconductor is poised for tremendously rapid growth and Tom's personal expertise in the area of high tech growth organizations will be an important asset to maximizing that growth", stated Richard Ellinger, American Semiconductor’s V.P. of Sales and Marketing.
About American Semiconductor
American Semiconductor, Inc. is the industry leader in high performance flexible integrated circuits. American Semiconductor designs, manufactures, and integrates ultra-thin electronic chips (technically called flexible integrated circuits – FleX™ IC’s) that bend like a sheet of paper to enable flexible hybrid electronics (FHE) for wearables, Internet of Things (IoT), smart-labels and smart-structure products. Visit us at www.americansemi.com.
American Semiconductor is a registered trademark of American Semiconductor, Inc. FleXform, FleXform-ADC, FleXform-MCU, FleX, Silicon-on-Polymer, FleX-ADC, FleX-MCU and FleX-IC are trademarks of American Semiconductor, Inc.
Boise, ID – American Semiconductor announces the appointment of Thomas Jensen to its Board of Directors. Mr. Jensen is a technologist and executive with a broad range of experience in areas of management at NIO and Tesla Motors, and in engineering roles at IDEO and Hewlett Packard. Thomas is well known as an early flexible electronics concept pioneer, and has founded three successful start-ups. His third success was with Paksense, Inc in 2004, where Thomas led the company to win a 2006 Wall Street Journal award for Best Technical Innovation and Idaho’s 2011 Innovative Company of the Year Award. He defined high-level architecture and the first toolsets for products at PakSense, and established the vision and strategy for launches into new markets that paved the way for the successful acquisition of the company in 2016 by Emerson. Thomas holds a BS, Computer Science degree from the University of Georgia and has a track record of technical innovation that includes 26 patents.
“Tom has agreed to serve on our board based on our shared vision of flexible hybrid electronics and our combined belief that the core technology to the explosive growth expected by all FHE market analysts lies within American Semiconductor’s core offering - flexible ICs. Jointly we believe American Semiconductor is poised for tremendously rapid growth and Tom's personal expertise in the area of high tech growth organizations will be an important asset to maximizing that growth", stated Richard Ellinger, American Semiconductor’s V.P. of Sales and Marketing.
About American Semiconductor
American Semiconductor, Inc. is the industry leader in high performance flexible integrated circuits. American Semiconductor designs, manufactures, and integrates ultra-thin electronic chips (technically called flexible integrated circuits – FleX™ IC’s) that bend like a sheet of paper to enable flexible hybrid electronics (FHE) for wearables, Internet of Things (IoT), smart-labels and smart-structure products. Visit us at www.americansemi.com.
American Semiconductor is a registered trademark of American Semiconductor, Inc. FleXform, FleXform-ADC, FleXform-MCU, FleX, Silicon-on-Polymer, FleX-ADC, FleX-MCU and FleX-IC are trademarks of American Semiconductor, Inc.
August 17, 2017 - American Semiconductor Participating in Innovation Day 2017 at NextFlex
ASI will be demonstrating flexible ICs at Innovation Day 2017 in San Jose, CA on September 21, 2017.
ASI will be demonstrating flexible ICs at Innovation Day 2017 in San Jose, CA on September 21, 2017.
May 2017 - Launched the world's first physically flexible System on Chip!
April 2017 - Awarded Boeing's Pathfinder Supplier of the Year