U.S. NDAA Initiates Renewal of Onshore Packaging, Assembly and Test
Washington DC, January 1, 2021 - A resurgence in U.S. semiconductor manufacturing began with the passage of the National Defense Authorization Act of 2021 (NDAA). Provisions in NDAA Title XCIX authorize what could be billions of dollars of incentives for the construction and modernization of U.S. semiconductor facilities, including those for advanced packaging, assembly and testing. Advanced packaging and related manufacturing is a key part of the semiconductor supply chain that occurs immediately following wafer fabrication. As wafer fab technical evolution, described as “Moore’s Law”, has slowed, advanced packaging concepts have moved to the forefront as the way to continue the evolution of semiconductor capability.
Washington DC, January 1, 2021 - A resurgence in U.S. semiconductor manufacturing began with the passage of the National Defense Authorization Act of 2021 (NDAA). Provisions in NDAA Title XCIX authorize what could be billions of dollars of incentives for the construction and modernization of U.S. semiconductor facilities, including those for advanced packaging, assembly and testing. Advanced packaging and related manufacturing is a key part of the semiconductor supply chain that occurs immediately following wafer fabrication. As wafer fab technical evolution, described as “Moore’s Law”, has slowed, advanced packaging concepts have moved to the forefront as the way to continue the evolution of semiconductor capability.
ASI Wins Technical Development Manufacturing Award for 2019 at the IDTechEx Show!
Boise, November 26, 2019 – At the 16th IDTechEx Printed Electronics USA conference and exhibition held in Santa Clara on November 20-21, American Semiconductor was honored with the award for Technical Development Manufacturing. In 2019, American Semiconductor, Inc. (ASI) installed the world’s first advanced packaging facility for Semiconductor-on-Polymer™ (SoP) Chip Scale Package (CSP) manufacturing in Boise, Idaho. Click here to see our time lapse video.
Boise, November 26, 2019 – At the 16th IDTechEx Printed Electronics USA conference and exhibition held in Santa Clara on November 20-21, American Semiconductor was honored with the award for Technical Development Manufacturing. In 2019, American Semiconductor, Inc. (ASI) installed the world’s first advanced packaging facility for Semiconductor-on-Polymer™ (SoP) Chip Scale Package (CSP) manufacturing in Boise, Idaho. Click here to see our time lapse video.
Our CEO, Doug Hackler, named Innovator of the Year for 2019 by Idaho Innovation Awards
Boise, October 30, 2019 – Idaho Innovation Awards named American Semiconductor, Inc., CEO Doug Hackler, Innovator of the Year on Wednesday October 23, 2019. The 14th annual Idaho Innovation Awards recognizes the innovations and entrepreneurs helping to drive Idaho’s economy. The program is organized by Stoel Rives LLP, Trailhead and the Idaho Technology Council (ITC).
Boise, October 30, 2019 – Idaho Innovation Awards named American Semiconductor, Inc., CEO Doug Hackler, Innovator of the Year on Wednesday October 23, 2019. The 14th annual Idaho Innovation Awards recognizes the innovations and entrepreneurs helping to drive Idaho’s economy. The program is organized by Stoel Rives LLP, Trailhead and the Idaho Technology Council (ITC).
Semiconductor-on-Polymer Chip-Scale Packaging (SoP CSP)
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Download the article here.
ASI Launches World’s First Fully Flexible, High Performance, Ultra-thin Bluetooth® IC
Boise, ID, February 20, 2019 - American Semiconductor, Inc. (ASI) today announced the launch of the new AS_NRF51822 FleX-BLE IC. The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth® Low Energy (BLE) communication. FleX-BLE is an ultra-thin and flexible SoP CSP version of Nordic Semiconductor’s nRF51822 Multiprotocol Bluetooth Low Energy/2.4 GHz RF System on Chip. This feature rich FleX-BLE product has an ARM® Cortex™ M0 processor, 256KB embedded Flash memory, 32KB RAM, encryption co-processor, temperature sensor, and 10-bit analog-to-digital converter. The FleX-BLE operates from 1.8-3.6V.
Boise, ID, February 20, 2019 - American Semiconductor, Inc. (ASI) today announced the launch of the new AS_NRF51822 FleX-BLE IC. The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth® Low Energy (BLE) communication. FleX-BLE is an ultra-thin and flexible SoP CSP version of Nordic Semiconductor’s nRF51822 Multiprotocol Bluetooth Low Energy/2.4 GHz RF System on Chip. This feature rich FleX-BLE product has an ARM® Cortex™ M0 processor, 256KB embedded Flash memory, 32KB RAM, encryption co-processor, temperature sensor, and 10-bit analog-to-digital converter. The FleX-BLE operates from 1.8-3.6V.
ASI Wins FLEXI Best Product Innovation Award!
Monterey, February 20, 2019 – American Semiconductor, Inc. (ASI), the global leader in physically flexible integrated circuits called Semiconductor-on-Polymer (SoP) has been awarded the 2019 FLEXI award for Product Innovation by FlexTech today for ASI's new FleX-NFC™ flexible NFC technology.
Monterey, February 20, 2019 – American Semiconductor, Inc. (ASI), the global leader in physically flexible integrated circuits called Semiconductor-on-Polymer (SoP) has been awarded the 2019 FLEXI award for Product Innovation by FlexTech today for ASI's new FleX-NFC™ flexible NFC technology.
HDM and ASI Announce JDA To Produce the World’s First High Reliability Ultra-Thin Packaged ICs
Boise, ID, February 15, 2019 - HD MicroSystemsTM (HDM) and American Semiconductor, Inc. (ASI) today announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets. The joint development will leverage American Semiconductor’s patented Wafer-level Chip Scale Packaging technologies that are encapsulated with advanced polyimide materials provided by HD MicroSystemsTM.
Boise, ID, February 15, 2019 - HD MicroSystemsTM (HDM) and American Semiconductor, Inc. (ASI) today announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets. The joint development will leverage American Semiconductor’s patented Wafer-level Chip Scale Packaging technologies that are encapsulated with advanced polyimide materials provided by HD MicroSystemsTM.
KTVB Covers ASI Launch of the World's First Smart Wine Bottle with A New Vintage Wine Shop
Boise, ID January 7, 2019 - American Semiconductor launches the world’s first truly Smart Wine Bottle using American Semiconductor’s patented FleX™ technology. American Semiconductor is the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE).
https://www.ktvb.com/video/news/keeping-it-local-worlds-first-smart-wine-bottle/277-959d28a9-8b7f-411e-851c-aee637a42791
Boise, ID January 7, 2019 - American Semiconductor launches the world’s first truly Smart Wine Bottle using American Semiconductor’s patented FleX™ technology. American Semiconductor is the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE).
https://www.ktvb.com/video/news/keeping-it-local-worlds-first-smart-wine-bottle/277-959d28a9-8b7f-411e-851c-aee637a42791
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Half Silicon, Half Plastic - ASI Discusses Flexible Hybrid Electronics
January 2, 2019 - https://www.eejournal.com/article/half-silicon-half-plastic/ by Bryon Moyer |
ASI Launches the World's First Smart Wine Bottle - Koenig Vineyards 2014 Cuvee Alden Private Reserve
American Semiconductor launches the world’s first truly Smart Wine Bottle using American Semiconductor’s patented FleX™ technology. American Semiconductor is the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE).
American Semiconductor launches the world’s first truly Smart Wine Bottle using American Semiconductor’s patented FleX™ technology. American Semiconductor is the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE).
ASI Wins IoT Award for Best IoT Technology Development at IDTechEx 2018
San Jose, November 14, 2018 – American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been awarded Best Technology Development for the Internet of Things (IoT) in 2018 by IDTechEx today for its new FleX-NFC™, flexible NFC technology.
San Jose, November 14, 2018 – American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been awarded Best Technology Development for the Internet of Things (IoT) in 2018 by IDTechEx today for its new FleX-NFC™, flexible NFC technology.
ASI and Molex announce demonstration of low-temp solder assembly capability for complex Flexible Hybrid Electronics
San Jose, August 6, 2018 – American Semiconductor and Molex have announced demonstration of low-temp solder assembly capability for complex Flexible Hybrid Electronics (FHE) systems by successfully attaching ultra-thin flexible integrated circuits (FleX-ICs), resistors and LEDs to printed Silver Flexible Circuits (SFCs). While others have demonstrated assembly of rigid test die and traditional packaged components to SFCs, American Semiconductor and Molex continue to lead innovation in manufacturing and assembly of truly thin and flexible systems without the traditional bulky components. The total thickness of the silver flexible circuit plus flexible IC is approximately 100µm.
San Jose, August 6, 2018 – American Semiconductor and Molex have announced demonstration of low-temp solder assembly capability for complex Flexible Hybrid Electronics (FHE) systems by successfully attaching ultra-thin flexible integrated circuits (FleX-ICs), resistors and LEDs to printed Silver Flexible Circuits (SFCs). While others have demonstrated assembly of rigid test die and traditional packaged components to SFCs, American Semiconductor and Molex continue to lead innovation in manufacturing and assembly of truly thin and flexible systems without the traditional bulky components. The total thickness of the silver flexible circuit plus flexible IC is approximately 100µm.
NextFlex Lauds American Semiconductor as Game Changers in Flexible Hybrid Electronics Through Delivery of Flexible Smart Asset Monitor and Tracking Tag
San Jose, July 18, 2018 - American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been honored by comments from NextFlex’s Director of Technology, Jason Marsh. “American Semiconductor’s leadership on the NextFlex-funded project – Flexible Smart Asset Monitor and Tracking Tag – along with partner Boise State University, recently resulted in delivery of completed demonstrators that prove that this game-changing flexible technology has advanced substantially. This new smart sensor tag utilizes long range RFID, can monitor temperature in real-time, includes an on-board battery, and due to its flexible form factor, it can repeatedly bend to 10mm in a radius bend test,” said Jason Marsh, NextFlex Director of Technology. “This is a great demonstration of print process applications for the packaging industry, particularly for pharma cold-chain. American Semiconductor’s talented team of engineers are advancing flexible hybrid electronics, and this smart asset tag illustrates how flexible hybrid electronics (FHE) can add value to supply chain management systems that reduce waste and improve quality time to market.”
San Jose, July 18, 2018 - American Semiconductor, Inc., the global leader in physically flexible integrated circuits and Flexible Hybrid Electronics (FHE), has been honored by comments from NextFlex’s Director of Technology, Jason Marsh. “American Semiconductor’s leadership on the NextFlex-funded project – Flexible Smart Asset Monitor and Tracking Tag – along with partner Boise State University, recently resulted in delivery of completed demonstrators that prove that this game-changing flexible technology has advanced substantially. This new smart sensor tag utilizes long range RFID, can monitor temperature in real-time, includes an on-board battery, and due to its flexible form factor, it can repeatedly bend to 10mm in a radius bend test,” said Jason Marsh, NextFlex Director of Technology. “This is a great demonstration of print process applications for the packaging industry, particularly for pharma cold-chain. American Semiconductor’s talented team of engineers are advancing flexible hybrid electronics, and this smart asset tag illustrates how flexible hybrid electronics (FHE) can add value to supply chain management systems that reduce waste and improve quality time to market.”