Be part of the U.S. resurgence in semiconductor manufacturing

In 2020, American Semiconductor, in collaboration with HD MicroSystems, completed the start-up of its initial 300mm advanced packaging, assembly and test capacity for ultra-thin electronics. The Boise site provides a purpose-built 300mm semiconductor packaging, assembly and test capability that also supports 200mm applications. The 2-acre research, development and pilot manufacturing site includes:

• 9,000 sq. ft. manufacturing facility
• Wafer Level Chip Scale Package fab (WLCSP fab) for Semiconductor-on-Polymer technology
• Thin-chip assembly for chip-on-flex and Hybrid Electronics
• Class 100 test area for 200/300mm wafers
• Office space for engineering, operations and corporate headquarters
• Pre-approved plans and acreage for further expansion

In 2021, the company is working to further establish advanced packaging, assembly and test capabilities consistent with the new U.S. initiatives for semiconductor manufacturing. If you would like to be part of this effort, please send us an email at sales@americansemi.com

Honors and Achievements

American Semiconductor is recognized for accomplishments in engineering and manufacturing of our state-of-the-art electronics packaging and assembly technology. We are honored to have received the following awards:

• 2019 IDTechEx Technical Development Manufacturing Award
• 2019 FLEXI (SEMI) Award for Product Innovation
• 2018 IDTechEx Best IoT Technology Development Award
• 2017 IDTechEx Best New Material or Component Development
• 2016 Boeing Supplier of the Year (Apr 2017) - Pathfinder
• 2015 Boeing Silver Performance Excellence
• 2013 FLEXI award for Innovation

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