Honors and Achievements
In the past 5 years, American Semiconductor has been recognized for our accomplishments in engineering and manufacturing of our state-of-the-art flexible electronics technology. We are honored to have received the following awards:
- 2016 Boeing Supplier of the Year (Apr 2017) - Pathfinder
- 2015 Boeing Silver Performance Excellence
- 2013 FLEXI award for Innovation
- 2013 OE-A LOPEC Best Business Case
- 2012 GOMAC Best Poster Paper
We are proud to partner with innovative companies whose revolutionary ideas have incorporated ASI's products and services. Included is a project with NASA (pictured to the left) with NASA Project RockSat-X. The purpose of that project was to evaluate the durability of ASI FleX materials when exposed to the harshness of space without shielding.
Our Lab
This site’s Advanced Flexible Hybrid Electronic Lab is one of the first in the country to develop and produce commercial FHE systems that integrate fully flexible ultra-thin ICs with printed electronic substrates. The lab is also used to develop FHE test methods and to conduct reliability testing for ultra-thin die, flexible interconnects and flexible printed substrates. The FHE lab capabilities include:
- Fisnar robotic direct write electronics system
- 200/300mm wafer taping station
- FHE materials press and lamination system
- Bond pull tester
- Programmable N2 purged bake
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Future Growth
With growth in mind, American Semiconductor, Inc. completed construction of its expanded corporate headquarters and manufacturing facility in Boise, Idaho in 2015. The Boise site is a purpose built manufacturing facility that includes site and facility capability to support high-volume manufacturing. The 2-acre site includes:
- 9000 ft2 manufacturing facility
- Dedicated Flexible Hybrid Electronics assembly and test lab
- A class 100 semiconductor cleanroom and test lab
- Dedicated manufacturing area and office space for engineering and corporate operations
- Pre-approval for expansion of an additional 6000 ft2 of manufacturing