Be part of the U.S. resurgence in semiconductor manufacturing
In 2020, American Semiconductor, in collaboration with HD MicroSystems, completed the start-up of its initial 300mm advanced packaging, assembly and test capacity for ultra-thin electronics. The Boise site provides a purpose-built 300mm semiconductor packaging, assembly and test capability that also supports 200mm applications. The 2-acre research, development and pilot manufacturing site includes:
- 9,000 sq. ft. manufacturing facility
- Wafer Level Chip Scale Package fab (WLCSP fab) for Semiconductor-on-Polymer technology
- Thin-chip assembly for chip-on-flex and Hybrid Electronics
- Class 100 test area for 200/300mm wafers
- Office space for engineering, operations and corporate headquarters
- Pre-approved plans and acreage for further expansion
Honors and Achievements

American Semiconductor is recognized for accomplishments in engineering and manufacturing of our state-of-the-art electronics packaging and assembly technology. We are honored to have received the following awards:
- 2019 IDTechEx Technical Development Manufacturing Award
- 2019 FLEXI (SEMI) Award for Product Innovation
- 2018 IDTechEx Best IoT Technology Development Award
- 2017 IDTechEx Best New Material or Component Development
- 2016 Boeing Supplier of the Year (Apr 2017) - Pathfinder
- 2015 Boeing Silver Performance Excellence
- 2013 FLEXI award for Innovation