American Semiconductor, Inc
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Flex Wafer Processing

American Semiconductor offers FleX Silicon-on-Polymer as a service to make your wafers ultra thin and physically flexible. 

FleX processing is available for wafers from any IDM or foundry. The FleX process can be applied to any silicon wafer, whether bulk or SOI. Currently all 200mm wafers are supported and 300mm is coming soon. ​
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​American Semiconductor, Inc               
6987 W. Targee Street 
Boise, Idaho 83709
​                                      

Office 208.336.2773

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© COPYRIGHT 2019 American Semiconductor, Inc. ALL RIGHTS RESERVED.
  • Home
  • Products
    • FleX-ICs
    • FHE Development Kits >
      • FleX-NFC Starter Kit
      • FleX-ADC Development Kit
    • Smart Labels
  • Services
    • FleX Wafer Processing
    • FHE Design & Integration
    • Thin Device Supply
  • Tech
    • Videos
    • Presentations
    • Papers & Articles
  • About
    • About ASI
    • News
    • Careers
    • Investors
    • Registered Users
  • Contact
  • Investors Links