FleX™ Silicon-on-Polymer™ is a revolutionary process for creating high-performance, single-crystalline CMOS with multi-layer metal interconnect on a flexible substrate. FleX enables a new generation of durable, pliable ICs that greatly improves the ability to integrate CMOS functionality in flexible electronics. FleX delivers fully functional, flexible wafers with a final silicon thickness as thin as 2000Å (angstroms). FleX can be applied to SOI processes from any foundry. FleX allows post thinning fab processing, enabling new capabilities for packaging and 3DIC integration.

FleX has been demonstrated both at the wafer scale as well as conformally mounted to an irregular surface. Test results of the same die as a full-thickness wafer and as a FleX wafer show little electrical shift with some parameters actually improving.

Product	Description	Datasheet
AS_OPA1001	FleX Dual General Purpose Op Amps	Datasheet​
AS_OPA4001	FleX Quad General Purpose Op Amps	Datasheet
AS_OPA4002	FleX Quad High Performance Op Amps	Datasheet
AS_OPA4003	FleX Quad Output Transconductance Op Amps	Datasheet​
AS_ADC100​x	FleX Analog-to-Digital Converter: 8-channels, 8-bits	Datasheet
AS_ADC2001	FleX Analog-to-Digital Converter with 3 Configurable Op Amps	Datasheet​
AS_CY820x	FleX SoC (System-on-a-Chip) with Capacitive Sense	​Datasheet
AS_EM4325P	FleX 900MHz RFID Communication Temp Monitoring IC	Datasheet
AS_NHS3100P	FleX NFC Temp Logging IC with Arm Cortex-M0+	Datasheet