Silicon-on-Polymer™ (SoP™) is a revolutionary packaging process for creating protected ultra-thin devices from high-performance, single-crystalline CMOS. FleX-C™ SoP packaging enables a new generation of durable, pliable, ultra-thin ICs that greatly improve the ability to integrate CMOS functionality on thin and even flexible circuit boards. SoP produces protected ICs with a final silicon thickness as thin as 2000Å (angstroms) and total package thicknesses less than 35um. FleX-C packaging can be applied to bulk or SOI CMOS wafers from any fab or foundry. SoP packaging enables new capabilities for advanced packaging, 3DIC and heterogeneous integration. FleX-ICs (chips packaged in FleX-C) have been demonstrated in conformal mounted applications to irregular surfaces. FleX-ICs enable the ultra-thin, chip-on-flex, flexible hybrid electronics markets. 
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​Small quantity thin-device availability can be challenging for new projects. American Semiconductor maintains an inventory of SoP packaged ICs that can be used for product development, evaluations and feasibility projects. Current inventory includes a variety of ultra-thin SoP chips from leading manufacturers such as Nordic, EM Microelectronic, NXP and Cypress, with capability for SOC, RFID, NFC and BLE®.

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Product	Description	Datasheet
AS_NRF51822P	​FleX BLE Bluetooth Low Energy with ARM Cortex-M0+	Datasheet
AS_NHS3100P	FleX NFC Temp Logging IC with Arm Cortex-M0+	Datasheet
AS_CY820x	​FleX SoC (System-on-a-Chip) with Capacitive Sense	​Datasheet
​​AS_EM4325P	​FleX 900MHz RFID Communication Temp Monitoring IC	​​Datasheet
​AS_OPA4002	​FleX Quad High Performance Op Amps	​Datasheet
​AS_OPA4003	FleX Quad Output Transconductance Op Amps	​Datasheet​
AS_ADC100​x	FleX Analog-to-Digital Converter: 8-channels, 8-bits	Datasheet
AS_ADC2001	​FleX Analog-to-Digital Converter with 3 Configurable Op Amps	​Datasheet​