FleX™ Silicon-on-Polymer™ is a revolutionary process for creating high-performance, single-crystalline CMOS with multi-layer metal interconnect on a flexible substrate. FleX-SoP™, also known as FleX-IC™, enables a new generation of durable, pliable ICs that greatly improves the ability to integrate CMOS functionality in flexible electronics. FleX-SoP™ delivers fully functional, flexible wafers with a final silicon thickness as thin as 2000Å (angstroms). FleX™ can be applied to SOI processes from any foundry. FleX™ allows post thinning fab processing, enabling new capabilities for packaging and 3DIC integration.

FleX has been demonstrated both at the wafer scale as well as con-formally mounted to an irregular surface. Test results of the same die as a full-thickness wafer and as a FleX wafer show little electrical shift with some parameters actually improving. 

FleX-ICs™ enable the flex electronics markets - specifically creating flexible hybrid electronics (FHE). The FHE market is growing and will explode in the market as more and more companies adopt the FleX-IC™.

Product	Description	Datasheet
AS_NRF51822P	​FleX BLE Bluetooth Low Energy with ARM Cortex-M0+	Datasheet
AS_NHS3100P	FleX NFC Temp Logging IC with Arm Cortex-M0+	Datasheet
AS_CY820x	​FleX SoC (System-on-a-Chip) with Capacitive Sense	​Datasheet
​​AS_EM4325P	​FleX 900MHz RFID Communication Temp Monitoring IC	​​Datasheet
​AS_OPA4001	​FleX Quad General Purpose Op Amps	​Datasheet
​AS_OPA4002	​FleX Quad High Performance Op Amps	​Datasheet
​AS_OPA4003	FleX Quad Output Transconductance Op Amps	​Datasheet​
AS_ADC100​x	FleX Analog-to-Digital Converter: 8-channels, 8-bits	Datasheet
AS_ADC2001	​FleX Analog-to-Digital Converter with 3 Configurable Op Amps	​Datasheet​