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American Semiconductor provides design and integration services for Flexible Hybrid Electronics including:
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FCB Design & Layout
Flexible Circuit Boards are similar in concept to traditional printed circuit boards (PCBs) in that they form circuitry for connecting ICs, passives, and other functions in a system design. However, FCBs are significantly different than PCBs in how they are manufactured. PCBs are typically fabricated by etching traces from copper sheets laminated on non-conductive layers. While FCBs can be fabricated with etched processes, it is often desirable to fabricate them with additive techniques where the conductive traces are printed onto non-conductive substrates. Conductive materials can be layered with non-conductive materials to form multi-layer FCBs. American Semiconductor has established capability across the printing industry that allows us to select the correct materials and methods for your FCB design and layout. |
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FCB Printing/Fabrication We work with leading printed electronics vendors to provide the best materials and methods for printing flexible electronics. American Semiconductor can deliver printed components in sheet or roll-to-roll formats, with materials ranging from bio-compatible to high-temp industrial capability. |
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FHE Assembly
Flexible hybrid assembly is challenging as it requires handling flexible substrates and FleX-ICs as well as traditional thin die, small packaged parts such as passsives, and different printed components. American Semiconductor has developed industry-leading capability for assembling hybrid components into full flexible hybrid systems. |
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Interconnect Printing
Flexible systems have unique electrical interconnect requirements that differ from traditional electronic systems. In order to maintain the benefits of flexible the interconnects must be created with materials and methods compatible with the substrates and devices, as well as remaining bendable during use. American Semiconductor has developed a variety of methods to ensure a suitable solution for application requirements, including direct printed and anisotropic (z-axis) interconnects. |
Functional Evaluation
Flexible hybrid systems require evaluation to ensure manufacturing methods and that functional products are being shipped to customers. American Semiconductor's test capability ensures quality at all levels of the process. IC test can be performed at parametric or system levels, whether ICs are full thickness, thin, or flexible, at both wafer scale and die level. Flexible circuits can be evaluated through simulation or functional testing of the printed circuits. System level testing ensures the finished product functionality. Test and debug capabilities provide failure analysis.
Reliability Testing
Flexible systems have reliability concerns that often differ from traditional electronics. Physical flexibility brings new challenges for reliability in non-flat conditions and body-worn systems must operate in warm, humid, often salty environments. American Semiconductor has established industry leading methods and specifications for the unique requirements of FHE reliability testing, including radius-of-curvature testing for simple and complex curves and both standard and accelerated lifetime testing.
Flexible hybrid systems require evaluation to ensure manufacturing methods and that functional products are being shipped to customers. American Semiconductor's test capability ensures quality at all levels of the process. IC test can be performed at parametric or system levels, whether ICs are full thickness, thin, or flexible, at both wafer scale and die level. Flexible circuits can be evaluated through simulation or functional testing of the printed circuits. System level testing ensures the finished product functionality. Test and debug capabilities provide failure analysis.
Reliability Testing
Flexible systems have reliability concerns that often differ from traditional electronics. Physical flexibility brings new challenges for reliability in non-flat conditions and body-worn systems must operate in warm, humid, often salty environments. American Semiconductor has established industry leading methods and specifications for the unique requirements of FHE reliability testing, including radius-of-curvature testing for simple and complex curves and both standard and accelerated lifetime testing.