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Flexible Hybrid Electronics Design & Integration

American Semiconductor provides Design and Integration services for Flexible Hybrid Electronics including:
  • Flexible Circuit Board (FCB) Design & Layout
  • Flexible Hybrid System Evaluation and Reliability Testing
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​FCB Design & Layout
Flexible Circuit Boards are similar in concept to traditional printed circuit boards (PCBs) in that they form circuitry for connecting ICs, passives, and other functions in a system design. However, FCBs are significantly different than PCBs in how they are manufactured. PCBs are typically fabricated by etching traces from copper sheets laminated on non-conductive layers. While FCBs can be fabricated with etched processes, it is often desirable to fabricate them with additive techniques where the conductive traces are printed onto non-conductive substrates. Conductive materials can be layered with non-conductive materials to form multi-layer FCBs.

American Semiconductor has established capability across the flexible circuit board industry that allows us to select the correct materials and methods for your FCB design and layout. 
Flexible Hybrid System Evaluation and Reliability Testing
Flexible hybrid systems require evaluation to ensure manufacturing methods and that functional products are being shipped to customers. American Semiconductor's test capability ensures quality at all levels of the process. Flexible circuits can be evaluated through simulation or functional testing of the printed circuits. System level testing ensures the finished product functionality. Test and debug capabilities provide failure analysis.
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Flexible systems have reliability concerns that often differ from traditional electronics. Physical flexibility brings new challenges for reliability in non-flat conditions and body-worn systems must operate in warm, humid, often salty environments. American Semiconductor has established industry leading methods and specifications for the unique requirements of FHE reliability testing, including radius-of-curvature testing for simple and complex curves and both standard and accelerated lifetime testing.
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​American Semiconductor, Inc               
6987 W. Targee Street 
Boise, Idaho 83709
​                                      

Office 208.336.2773

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© COPYRIGHT 2021 American Semiconductor, Inc. ALL RIGHTS RESERVED.
  • Home
  • Products
    • FleX-ICs
    • FHE Development Kits >
      • Thin and Flexible Bluetooth™ Development Kit
      • FleX-NFC Starter Kit
      • FleX-ADC Development Kit
    • Smart Labels >
      • Data Logger Labels
      • Smart Tags
  • Services
    • SoP Packaging
    • Assembly & Test
    • FHE Design & Integration
  • Tech
    • Presentations
    • Videos
    • Papers & Articles
  • About
    • About ASI
    • Investors
    • Registered Users
  • News
  • Careers
  • Contact