Lead Hardware Engineer
Job Summary: The ideal candidate will engineer new capabilities for package and board level design and assembly from prototype to volume manufacturing. The Lead Hardware Engineer plans and conducts hardware and system design, manufacturing and testing requiring judgment in the evaluation, selection, and adaptation or modification of standard techniques, procedures, and criteria. This will include board design, package design, materials and component selection, test methodologies, design for manufacturing, and yield/throughput optimization. This role includes customer technical communication. The position may include technical project management and/or provide project oversight of hardware and software engineering team members. The position has the potential for future technology program management.
Responsibilities:
Personal traits: Pro-active, innovative and energetic. Must have a can-do attitude, hands-on and able to multi-task. Good written and oral communication skills are a requirement for both team leadership and customer-facing communication. Aptitude and ability to make things is highly valued, and can be evidenced by work or non-work experience related to electronics, computer, electrical, hardware fabrication or mechanics.
Education and Experience: B.S. in Electrical Engineering, M.S. in Electrical Engineering or related degree with 7 years of related experience.
Compensation: Salary is based on the level of applicable education and experience. This position may include significant stock options for participation in the growth of the company. Medical benefits are part of the total compensation package.
Advancement: Future advancement in all corporate areas is possible.
U.S. Work Status: Only local candidates (Boise, Idaho) or those willing to relocate at their own expense will be considered. Due to the nature of our work, this position requires the ability to obtain and maintain a Department of Defense security clearance.
MANUFACTURING ASSEMBLY ENGINEER
Job Summary: The ideal candidate will support development of new manufacturing capabilities for board level assembly from prototype to volume manufacturing. The Manufacturing Engineer performs multiple engineering-related tasks in various assignments within the organization. This includes independently evaluating, selecting, and applying standard engineering techniques, procedures, and criteria, using judgment in making adaptations and modifications. Assignments have clear and specified objectives. This position requires a hands-on engineer willing to tackle multiple new technological challenges.
Responsibilities:
Personal traits: Interests in assembly and advanced packaging including FCB, SiP, heterogeneous integration, chiplets and similar. Pro-active, innovative and energetic. Must have a can-do attitude, hands-on and able to multi-task. Aptitude and ability to make things is highly valued, very helpful and should be evidenced by manufacturing experience, assembly experience or non-work related computer, electronic, electrical or hardware fabrication.
Education and Experience: B.S. in Electrical or Mechanical Engineering, M.S. in Electrical or Mechanical Engineering or related degree with 5 years of related professional experience
Compensation: Salary is based on the level of applicable education and experience. This position may include significant stock options for participation in the growth of the company. Medical benefits are part of the total compensation package.
Advancement: Future advancement in all corporate areas is possible.
U.S. Work Status: Only local candidates (Boise, Idaho) or those willing to relocate at their own expense will be considered. Due to the nature of our work, this position requires the ability to obtain and maintain a Department of Defense security clearance.
ACCOUNT MANAGER
Job Summary: This is a direct sales position. The Account Manager generates leads for new customer opportunities and understands and communicates new customer requirements to the company including technical, operational, and commercial elements. The Account Manager creates and executes, with appropriate company personnel, strategy, and tactics to close new business. S/He participates in the establishment of the company sales forecast. S/He maintains regular communication with customers driving customer issues within the company while ensuring customers receive appropriate feedback on company’s actions.
Responsibilities:
Desired previous experience: Has extensive background in technical sales, service and operations and understands the relationships between the functions. Has basic experience in P&L management and understands the relationship between gross margin and net profit.
Personal traits: This position is a prime fit for an individual that has an entrepreneurial spirit and is ready to leverage his or her skills to help build ASI. The successful candidate must be pro-active, able to identify issues and initiate actions and activities to solve problems. S/He will embrace having a wide degree of creativity and latitude. S/He has a can-do attitude, willing to work until success is achieved, and able to multi-task. S/He relies on extensive experience and judgment to plan and accomplish goals of sales and account management. S/He is familiar with a variety of semiconductor applications, concepts, practices, and procedures.
Education: Master’s in Business with a BS in Engineering is preferred. At a minimum, a BS degree is required with at least 3 years semiconductor industry experience.
Compensation: Base Salary + Bonus and/or Commission is based on the level of applicable education and experience. Stock options may be included. Medical benefits are part of the total compensation package.
U.S. Work Status: Only local candidates (Boise, Idaho) or those willing to relocate at their own expense will be considered. Due to the nature of our work, this position requires the ability to obtain and maintain a Department of Defense security clearance.
To apply, send resume and cover letter via email to: jobs@americansemi.com. In order to be considered, your application must include salary requirements and at least two references. No telephone calls, please.
FUTURE OPPORTUNITIES – American Semiconductor Advanced Packaging (ASAP)
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. We are working to determine the availability of packaging, assembly and test professionals to demonstrate project feasibility. The potential jobs that are associated with this project are contingent on final project approval. If you have experience in any of the following categories and are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Job Summary: The ideal candidate will engineer new capabilities for package and board level design and assembly from prototype to volume manufacturing. The Lead Hardware Engineer plans and conducts hardware and system design, manufacturing and testing requiring judgment in the evaluation, selection, and adaptation or modification of standard techniques, procedures, and criteria. This will include board design, package design, materials and component selection, test methodologies, design for manufacturing, and yield/throughput optimization. This role includes customer technical communication. The position may include technical project management and/or provide project oversight of hardware and software engineering team members. The position has the potential for future technology program management.
Responsibilities:
- Package and Board development including flexible circuit board (FCB) systems using state-of-the-art ultra-thin flexible ICs
- Design and development of SoP WLCSP for customer ICs
- Hardware engineering support for all areas of design, packaging, assembly and test
- Leading level 1-3 engineers or technicians directly as a group-wide subject matter expert
- Technical and project documentation creation, maintenance and reporting as necessary
- Experience in PCB/FCB system design, layout and evaluation
- Mixed-signal and/or RF product design, layout and testing ability
- Hands on experience in design and hardware verification using automated waferscale probe, logic analyzers, bus analyzers and digital scopes, etc.
- Excellent analytical and problem-solving skills
- Strong communication, interpersonal, and planning skills
Personal traits: Pro-active, innovative and energetic. Must have a can-do attitude, hands-on and able to multi-task. Good written and oral communication skills are a requirement for both team leadership and customer-facing communication. Aptitude and ability to make things is highly valued, and can be evidenced by work or non-work experience related to electronics, computer, electrical, hardware fabrication or mechanics.
Education and Experience: B.S. in Electrical Engineering, M.S. in Electrical Engineering or related degree with 7 years of related experience.
Compensation: Salary is based on the level of applicable education and experience. This position may include significant stock options for participation in the growth of the company. Medical benefits are part of the total compensation package.
Advancement: Future advancement in all corporate areas is possible.
U.S. Work Status: Only local candidates (Boise, Idaho) or those willing to relocate at their own expense will be considered. Due to the nature of our work, this position requires the ability to obtain and maintain a Department of Defense security clearance.
MANUFACTURING ASSEMBLY ENGINEER
Job Summary: The ideal candidate will support development of new manufacturing capabilities for board level assembly from prototype to volume manufacturing. The Manufacturing Engineer performs multiple engineering-related tasks in various assignments within the organization. This includes independently evaluating, selecting, and applying standard engineering techniques, procedures, and criteria, using judgment in making adaptations and modifications. Assignments have clear and specified objectives. This position requires a hands-on engineer willing to tackle multiple new technological challenges.
Responsibilities:
- Develop and implement new capabilities for board level systems
- Board assembly with state-of-the-art ultra-thin flexible SoP CSP ICs and SMT
- Define, develop and optimize flip-chip thin device assembly equipment and processes
- Define manufacturing processes and rules for their use by other team members
- Work with technical cross-functional teams and customers developing new products
- May supervise or coordinate the work of manufacturing technicians and layout engineers
- Manufacturing experience in board assembly, pick-and-place of SMT components and die
- Excellent analytical and problem-solving skills
- Familiar with the use of assembly tools, electronics, robotics and vision systems
- Familiar with installation, start-up, utilization, application and sustaining capital equipment
- Ability to work well with others
Personal traits: Interests in assembly and advanced packaging including FCB, SiP, heterogeneous integration, chiplets and similar. Pro-active, innovative and energetic. Must have a can-do attitude, hands-on and able to multi-task. Aptitude and ability to make things is highly valued, very helpful and should be evidenced by manufacturing experience, assembly experience or non-work related computer, electronic, electrical or hardware fabrication.
Education and Experience: B.S. in Electrical or Mechanical Engineering, M.S. in Electrical or Mechanical Engineering or related degree with 5 years of related professional experience
Compensation: Salary is based on the level of applicable education and experience. This position may include significant stock options for participation in the growth of the company. Medical benefits are part of the total compensation package.
Advancement: Future advancement in all corporate areas is possible.
U.S. Work Status: Only local candidates (Boise, Idaho) or those willing to relocate at their own expense will be considered. Due to the nature of our work, this position requires the ability to obtain and maintain a Department of Defense security clearance.
ACCOUNT MANAGER
Job Summary: This is a direct sales position. The Account Manager generates leads for new customer opportunities and understands and communicates new customer requirements to the company including technical, operational, and commercial elements. The Account Manager creates and executes, with appropriate company personnel, strategy, and tactics to close new business. S/He participates in the establishment of the company sales forecast. S/He maintains regular communication with customers driving customer issues within the company while ensuring customers receive appropriate feedback on company’s actions.
Responsibilities:
- The Account Manager is primarily responsible for the identification, development and closing of business opportunities (sales) at the appropriate time and $ level to meet the company sales forecast and revenue plan
- Provide the primary point-of-contact for existing and potential customers within their assigned market and/or region
- Ensure that the company is kept informed on all significant activity with potential and existing customers including timely sales funnel, sales forecast and delivery requirements updates
- Continually provides feedback to company on customer expectations and opportunities to improve product offerings
- Maintains clear understanding of market segments addressed by companies’ products and continuously seeks to find new markets for company to penetrate
- Understands fundamentals of the company’s technologies and how they meet customer requirements
- Other sales related activities as assigned to support sales growth
Desired previous experience: Has extensive background in technical sales, service and operations and understands the relationships between the functions. Has basic experience in P&L management and understands the relationship between gross margin and net profit.
Personal traits: This position is a prime fit for an individual that has an entrepreneurial spirit and is ready to leverage his or her skills to help build ASI. The successful candidate must be pro-active, able to identify issues and initiate actions and activities to solve problems. S/He will embrace having a wide degree of creativity and latitude. S/He has a can-do attitude, willing to work until success is achieved, and able to multi-task. S/He relies on extensive experience and judgment to plan and accomplish goals of sales and account management. S/He is familiar with a variety of semiconductor applications, concepts, practices, and procedures.
Education: Master’s in Business with a BS in Engineering is preferred. At a minimum, a BS degree is required with at least 3 years semiconductor industry experience.
Compensation: Base Salary + Bonus and/or Commission is based on the level of applicable education and experience. Stock options may be included. Medical benefits are part of the total compensation package.
U.S. Work Status: Only local candidates (Boise, Idaho) or those willing to relocate at their own expense will be considered. Due to the nature of our work, this position requires the ability to obtain and maintain a Department of Defense security clearance.
To apply, send resume and cover letter via email to: jobs@americansemi.com. In order to be considered, your application must include salary requirements and at least two references. No telephone calls, please.
FUTURE OPPORTUNITIES – American Semiconductor Advanced Packaging (ASAP)
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. We are working to determine the availability of packaging, assembly and test professionals to demonstrate project feasibility. The potential jobs that are associated with this project are contingent on final project approval. If you have experience in any of the following categories and are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
- Advanced Packaging Engineers and Technicians
- Advanced Packaging Operations Management, Supervisors, Planners, Operators
- Advanced Packaging Quality and Reliability Manager, Engineers, Technicians
- Advanced Packaging Design Engineers