American Semiconductor in Boise is developing ultra-thin advanced packaging technology. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. Availability of highly qualified packaging professionals to support the expansion must be verified for project feasibility. The potential jobs that are associated with this project are contingent on final project approval.
Advanced Packaging Engineers and Technicians
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities with engineers that have experience related to semiconductor packaging and assembly in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Advanced Packaging Operations Management, Supervisors, Planners, Operators
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities for all levels of operations that have experience related to semiconductor packaging and assembly in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Advanced Packaging Quality and Reliability Manager, Engineers, Technicians
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities for all levels of Quality and Reliability professionals that have experience related to semiconductor packaging and assembly in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Advanced Packaging Design Engineers
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities with engineers that have experience related to advanced packaging design in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Advanced Packaging Engineers and Technicians
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities with engineers that have experience related to semiconductor packaging and assembly in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Advanced Packaging Operations Management, Supervisors, Planners, Operators
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities for all levels of operations that have experience related to semiconductor packaging and assembly in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Advanced Packaging Quality and Reliability Manager, Engineers, Technicians
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities for all levels of Quality and Reliability professionals that have experience related to semiconductor packaging and assembly in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.
Advanced Packaging Design Engineers
American Semiconductor in Boise is developing ultra-thin advanced packaging technology. The company currently maintains a pilot line for 200mm and 300mm processing in Boise supporting commercial and government contract manufacturing. We are working to respond to the newly passed National Defense Authorization Act (NDAA) that funds reshoring advanced packaging in the U.S. We have an immediate need to contact and discuss future employment opportunities with engineers that have experience related to advanced packaging design in the Boise area. The goal of this effort is to create a new large-scale advanced packaging operation in the Boise area. If you are interested in discussing this potential opportunity, please contact jobs@americansemi.com for more information.