American Semiconductor provides Assembly and Test services for thin-device technology including:
- Assembly for Thin Devices
- Test for completed SoP ICs
American Semiconductor provides IC test capability for ultra-thin SoP ICs. Wafer level probe capability for 200mm and 300mm is available. This includes automated test capability for SoP post-packaging tape-on-frame. American Semiconductor can develop the probe card hardware and test programs needed to provide functional testing before, during and after SoP packaging to meet customer requirements. For programs that are producing sensors or passive thin-devices, American Semiconductor can provide a wide range of device characterization services.