About
American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
Company History
American Semiconductor began in 2001 as a CMOS process technology development company specializing in CMOS fabrication and IC design for high altitude electronics. In 2012, the company made a strategic pivot to focus on commercialization of ultra-thin device fabrication using Semiconductor-on-Polymer™ advanced packaging technology. In 2015 the company broke ground on its first production facility for advanced packaging and expanded that capability through a joint venture with HD MicroSystems in 2019. Today, American Semiconductor provides industry leading thin device capability for WLCSP, assembly and test, and delivers complete solutions from development and integration through pilot production.
American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
Company History
American Semiconductor began in 2001 as a CMOS process technology development company specializing in CMOS fabrication and IC design for high altitude electronics. In 2012, the company made a strategic pivot to focus on commercialization of ultra-thin device fabrication using Semiconductor-on-Polymer™ advanced packaging technology. In 2015 the company broke ground on its first production facility for advanced packaging and expanded that capability through a joint venture with HD MicroSystems in 2019. Today, American Semiconductor provides industry leading thin device capability for WLCSP, assembly and test, and delivers complete solutions from development and integration through pilot production.