• 
  ITC Award for Innovator of the Year
  won on October 23, 2019

• 
  The Flexible
  ​Future is NOW!

• 
  Introducing the World's First Ultra-thin NFC Starter Kit - available today!!!

This changes everything!

During 2019, American Semiconductor, Inc. (ASI) installed the world’s first advanced packaging facility for Semiconductor-on-Polymer™ (SoP) Chip Scale Package (CSP) manufacturing in Boise, Idaho. Click the image on the right to begin the time-lapse slide show. SoP CSP is used to produce thin and flexible high-performance silicon integrated circuit (ICs) which when combined with printed electronics enables high performance hybrid printed electronics. The new production capacity provides ultra-thin packaged ICs that enable electronics to be applied in applications never before possible for IoT, Consumer wearables, Automotive, Appliances, Healthcare and Logistics. ASI’s new facility also expanded capabilities for automated production assembly of chip on flex and advanced Flexible Hybrid Electronics (FHE) systems. 

Learn More

ASI Wins 3 Awards in 2019

CUSTOMERS
American Semiconductor's flexible products and services provide unlimited possibilities. ASI's offerings include FleX™ Semiconductor-on-Polymer™ products and processing servers, Flexible Hybrid technology and more. 

Visit our Products and Services pages for details. 

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INVESTORS
​Flexible technology is the future, and the flexible future is now. American Semiconductor's Flex™ Semiconductor-on-Polymer™ is a revolutionary process for creating high-performance semiconductors on a flexible substrate. FleX™ enables a new generation of durable, pliable integrated circuits that greatly improve the ability to integrate semiconductor functionality in flexible electronics. 

Interested in finding out more? Check out our Investors page. 

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