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  American Semiconductor is the industry leader in ultra-thin chip packaging. We develop and manufacture state-of-the-art ultra-thin electronics technology.

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  Wafer Level Chip Scale Packaging

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  Class 100 Test

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  Thin Device Assembly

We are the semiconductor manufacturing service provider that specializes in thin electronics

American Semiconductor (ASI) thin-device capability is based on Semiconductor-on-Polymer™ packaging that makes the thinnest devices possible. As the leader in ultra-thin device technology, ASI provides a complete range of services for thin electronic system manufacturing. ASI's extensive thin-device expertise, capabilities, and facilities enable us to support your program requirements for new product development and volume manufacturing.

ASAP INITIATIVE​

ASAP (American Semiconductor Advanced Packaging) is an initiative to create a new world-class advanced package manufacturing capability in Idaho. ASAP will extensively expand the Semiconductor-on-Polymer™ technology roadmap into leading edge contract manufacturing capacity for high volume advanced IC packaging in support of multi-chip, SiP, PoP, heterogeneous integration and related R&D. Idaho has a long and rich history in leading edge packaging and assembly. This initiative promotes boosting the current intellectual talent that is available in this region and fosters the development of future technologists that will contribute to new innovations in advanced packaging. The ASAP initiative is in support of the U.S. investment in semiconductor technology recently introduced in Title XCIX of the 2021 NDAA.

See future job opportunities on the Career page.

CUSTOMERS
American Semiconductor's advanced packaging technology and services provide ultra-thin capabilities. ASI's offerings include Semiconductor-on-Polymer™ chip scale packaging, chip-on-flex assembly and a wide variety of engineering and design services. 
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Visit our Products and Services pages for details. ​

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INVESTORS
Advanced Packaging is the future for semiconductor technology. American Semiconductor's Semiconductor-on-Polymer™ (SoP) produces the thinnest packaged ICs possible and is a revolutionary process for protected Fan-In. SoP enables next generation, low cost, high reliability, ultra-thin integrated circuits that greatly improve the ability to integrate semiconductor functionality for thin PCB, Fan-Out, Heterogenous Integration and multi-chip advanced packaging. 

Interested in finding out more? Check out our Investors page. ​

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