FleX-C & SoP-TM ICs
Small quantity thin-device availability can be challenging for new projects. American Semiconductor maintains an inventory of SoP packaged ICs that can be used for product development, evaluations and feasibility projects. Current inventory includes a variety of ultra-thin SoP chips from leading manufacturers such as Nordic, EM Microelectronic, NXP and Cypress, with capability for SOC, RFID, NFC and BLE®.
Downloads & Resources
- AS_SoPTM54AP: Flexible Interconnect Test IC
- AS_BLES02INTxxx: Flexible BLE Interposer
- AS_NRF51822P: FleX BLE Bluetooth Low Energy with ARM Cortex-M0+
- AS_NHS3100P: FleX NFC Temp Logging IC with Arm Cortex-M0+
- AS_CY820x: FleX SoC (System-on-a-Chip) with Capacitive Sense
- AS_EM4325P: FleX 900MHz RFID Communication Temp Monitoring IC
- AS_OPA4002: FleX Quad High Performance Op Amps
- AS_OPA4003: FleX Quad Output Transconductance Op Amps
- AS_ADC100x: FleX Analog-to-Digital Converter: 8-channels, 8-bits
- AS_ADC2001: FleX Analog-to-Digital Converter with 3 Configurable Op Amps
FleX-ICs Download Form
