Wafer Thinning & Grinding
Wafer thinning services are available for all 200mm and 300mm silicon wafers. Our Disco DGP8761 is a state-of-the-art grind tool that has demonstrated grind as thin as 2um. We grind unsupported wafers, wafers on grinding tape, and temporarily bonded wafers. We offer stress relief options including CMP, dry polish, and polygrind.