Thin Device Supply
Procuring and managing thin devices can be challenging. American Semiconductor has the capability to provide thin devices in any target thickness. Additionally, we provide thin die in small volumes which is critical for R&D and prototyping programs.
In addition to FleX-ICs, American Semiconductor can supply conventional thin-devices for customers that need ICs not yet available in FleX technology. American Semiconductor’s advanced 300mm grind capability (coming late 2016) can support wafers as thin as 5 um. Our current 200mm capability has similar capability and is immediately available.