Technology

FleX™ Silicon-On-Polymer™ is a revolutionary substrate conversion process that provides flexible ICs and fully flexible wafers. FleX enables the next generation of integrated flexible electronics.

Design & Development Services is a turnkey design engineering and product development solution providing engineering expertise in a variety of foundry processes as well as FleX Silicon-on-Polymer and related flexible electronics applications.

Flexfet™ is advanced SOI CMOS technology. Flexfet Independent Double Gated Transistor technology provides dynamic threshold control and is ultra low power, inherently radiation tolerant, and scalable to 65nm and below.

AS045BK is a 45nm bulk CMOS foundry process designed for commercial, military, and aerospace applications. What makes AS045BK different is that it was built from the ground up to be economically viable, especially for R™D and low volume production.