Doug Hackler, Ed Prack PhD IMAPS 2023 A strong supply chain requires higher performance and lower cost processes. DCA conventionally referred to as WLCSP has been used for low density devices, however for higher density devices, reliability concerns have emerged....
Papers & Articles
Defining Advanced Manufacturing
Doug Hackler Read More
Protected Wafer Level Chip Scale Packaging (P-WLCSP)
Doug Hackler, Ed Prack PhD IMAPS 2022, Boston Read More
Advanced Protected Fan-In WLCSP
Doug Hackler, Ed Prack PhD IMAPS 2021 Read More
Counterfeit Vaccines are proliferating and threaten to undermine the Covid-19 rollout
American Semiconductor White PaperJanuary 2021 Download Content
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Douglas Hackler, Edward PrackIMAPS, 2020 Download Content