American Semiconductor, Inc. 200mm CMOS Foundry

Multi-Project Wafer Program


Die Image

Multi-Project Wafers, or shuttle runs, combine designs from multiple customers into one mask set and wafer lot. This allows costs to be shared across a number of program participants and provides a cost-effective method for prototype and proof-of-concept silicon. As an additional benefit, American Semiconductor's direct MPW program allows customers to work directly with the foundry for design and process support.

Participating in American Semiconductor's MPW program is straightforward. A customer reserves a MPW field and is provided a full FF180 Process Development Kit (PDK). Customers provide their designs as GDSII data and receive finished die after fabrication. Packaging services are available as an option for customers that prefer to receive packaged parts.

Multi-Project Wafer
Program Advantages

  • Access to 180nm Flexfet™ Advanced CMOS Technology

  • Enables low cost prototype silicon

  • Extendable to low volume production

  • Available for SBIR programs

  • On-shore, ITAR compliant

  • Design and Process support directly from American Semiconductor





Multi-Project Wafer
Program Details

  • Fields for April 2010 run available now

  • Standard delivery of 40 die

  • Additional die delivery options available

  • Packaging services available

  • Contact Us for pricing and schedule details