Frequently Asked Questions
- What products does American Semiconductor offer?
- Does American Semiconductor offer MPW (Multi Project Wafers)?
- Does American Semiconductor do custom processing?
- How much does a wafer lot cost?
- Does American Semiconductor meet ITAR requirements?
- What is American Semiconductor's ticker symbol?
- What process technology is American Semiconductor capable of running?
- What wafer size do you run?
- What is your minimum lot size?
- Does American Semiconductor have copper BEOL?
- What is SOI?
- What is a MIGFET?
- What is a MUGFET?
- What is Flexfet?
- Is Flexfet a MIGFET?
- Is Flexfet a MUGFET?
- What is Dynamic Threshold Control?
- What is Ultra Low Power?
- Why is low voltage important to ULP?
- How does Flexfet achieve ULP?
- What kind of power savings can I expect with Flexfet ULP?
- Why is Flexfet ULP better than other approaches, such as voltage scaling?
- How is Flexfet radiation tolerant?
- What is the benefit of the gate last process?
- Can Flexfet be used to build imagers and other detectors?
- Is Flexfet supported with PDKs (Process Development Kits)?
- What is FleX?
- Does FleX allow post thinning fab processing?
- How do you make a wafer so thin?
- What is Custom Fabrication?
- How do I install my process into your fab?
- Can I develop custom process with American Semiconductor?
- Can I integrate novel materials and processes with American Semiconductor?
- What is Copy Smart?
- What is Copy Exact?
- Which is better, Copy Smart or Copy Exact?
- What experience does the design team have?
- What is your design flow?
- Can you design with processes other than American Semiconductor's Flexfet?
- Can you provide a system development platform for my micro-controller?
- What design services are available?
General FAQs
Q. What products does American Semiconductor offer?
A. We are a pure-play foundry. Our end products are silicon wafers for our customers.
Q. Does American Semiconductor offer MPW (Multi Project Wafers)?
A. Yes. Follow the link for MPW Program Details.
Q. Does American Semiconductor do custom processing?
A. Yes. More information can be found at
Custom Fabrication
or Custom Fabrication FAQs.
Q. How much does a wafer lot cost?
A. That depends on a variety of factors, including process node, standard or
custom process, number of metal layers, and such. Please
contact us for pricing.
Q. Does American Semiconductor meet ITAR requirements?
A. Yes.
Q. What is American Semiconductor's ticker symbol?
A. We are a privately held company and therefore do not have a ticker symbol.
General FAQ Category Index Top of Page
Technology FAQs
Q. What process technology is American Semiconductor capable of running?
A. Flexfet is currently available at 130nm and 180nm. We are currently capable
of running 65nm for critical features.
Q. What wafer size do you run?
A. 200mm.
Q. What is your minimum lot size?
A. 12 wafers.
Q. Does American Semiconductor have copper BEOL?
A. Yes, we have copper in addition to our standard aluminum.
Q. What is SOI?
A. Silicon-on-Insulator wafers.
Q. What is a MIGFET?
A. MIGFET stands for Multiple Independent Gate Field Effect Transistor. Traditional
CMOS processes use single gates. MIGFETs have multiple gate surfaces and provide
independent control of each gate. Vertical structures, such as FinFET, have been
shown conceptually and demonstrated in low volume R&D processes in MIGFET
configurations. Flexfet is a more mature MIGFET technology and available for
prototype production.
Q. What is a MUGFET?
A. MUGFET stands for MUltiple Gate Field Effect Transistor. MUGFETS have multiple
gate surfaces but only have a single gate electrode. FinFET is an example of
a MUGFET. Flexfet can be configured as a MUGFET using Double Gated (DG) mode.
Technology FAQ Category Index Top of Page
Flexfet FAQs
Q. What is Flexfet?
A. Flexfet is an advanced CMOS process characterized by an Independently Double Gated
transistor. The novel design of the Flexfet transistor brings many benefits not
realized in standard CMOS processes. Flexfet enables Dynamic Threshold Control
(DTC), enabling threshold voltage (Vt) to be controlled on-the-fly. Additionally,
Flexfet enables Ultra Low Power (ULP) operation, with Flexfet ULP running at or
below 0.5V, fully depleted. Flexfet
is a gate-last process, which enables integration of novel materials with low
thermal budgets. The unique IDG design and SOI processing of Flexfet create an
inherent radiation tolerance, which is extremely useful in avionics and space
systems. Flexfet is commercially available as a foundry process from American
Semiconductor with standard Process Development Kits available for 180nm and 130nm
nodes, and the Radiation Effects Process Development Kit (RE-PDK) in development with
support from Air Force Research Labs SHARE program.
Q. Is Flexfet a MIGFET?
A. Yes. Flexfet CMOS is characterized by an Independently Double Gated (IDG)
transistor. Flexfet is a true MIGFET. See the MIGFET topic in the
Technology FAQs.
Q. Is Flexfet a MUGFET?
A. Yes. In Double Gated (DG) mode, Flexfet's top and bottom gates are tied
together. In DG mode Flexfet is a MUGFET. See the MUGFET topic in the
Technology FAQs
Q. What is Dynamic Threshold Control?
A. Dynamic Threshold Control (DTC) enables threshold voltage (Vt) to be controlled
on-the-fly. DTC allows the same product to be optimized for speed, operating
power, and standby power. DTC can be used at various levels of a design - at
the transistor, circuit, or chip level.
Q. What is Ultra Low Power?
A. Ultra Low Power (ULP) is the quest of many electronics systems. The benefits
depend on the system. For example, battery powered applications can run longer
between recharges, and performance systems generate less
heat, reducing or eliminating cooling needs and improving reliability. ULP is
generally achieved by reducing voltage.
Q. Why is low voltage important to ULP?
A. This is answered by looking at the CMOS power equation:
P = f * C * V^2,
where P=power, f=frequency, C=capacitance, and V=voltage
Since voltage is squared, it has the greatest impact on power.
Q. How does Flexfet achieve ULP?
A. As noted in the question above, voltage reduction is the single most significant
influence on power. Flexfet enables deep sub-volt circuits, down to 0.25V on the
180nm Flexfet process (August 2009 results).
Q. What kind of power savings can I expect with Flexfet ULP?
A. That is hard to answer here. It really depends on where your starting point is,
and can vary based on design practices. However, an accepted rule of thumb is
that for every 10% decrease in voltage, a 30% decrease in power could be expected.
Q. Why is Flexfet ULP better than other approaches, such as voltage scaling?
A. Flexfet supports both independently double-gated operation for dynamic power
control and double-gated operation for steeper subthreshold slope and better
performance at low voltage. These capabilities are not available in standard CMOS
processes.
Q. How is Flexfet radiation tolerant?
A. Flexfet is an SOI (Silicon-On-Insulator) process. SOI is inherently immune to
Single Event Latchup (SEL). The ultra-thin SOI silicon of Flexfet reduces the
collection area for charged particles and therefore dramatically improves SEE
performance including reduction in Single Event Upset (SEU) and Single Event Transients
(SET). Standard SOI transistors do have problems
with TID (Total Ionizing Dose) due to charge trapped in the BOX (Buried Oxide).
Flexfet's Independently Double Gated design mitigates TID effects since the bottom
gate effectively shields the channel from trapped charge in the
BOX.
Q. What is the benefit of the gate last process?
A. Flexfet's gate last process enables the use of temperature sensitive gate
dielectrics, metal gates, and novel materials that have low thermal budgets.
Q. Can Flexfet be used to build imagers and other detectors?
A. Yes. Diodes built in the substrate typically require a large bias applied to
the substrate. Detectors allow charge collection from high-energy particles
passing through the substrate. The Flexfet process allows large substrate biases
without performance degradation. Additionally, Flexfet is unaffected by the
associated radiation-induced trapped charge in the BOX. Flexfet enables Monolithic
Active Pixel Sensors (MAPS) by allowing logic and devices on the same die
as the detector, reducing system cost and improving performance.
Q. Is Flexfet supported with PDKs (Process Development Kits)?
A. Yes. Flexfet is supported with both PDPs (Preliminary Design Packages) and PDKs.
See the Flexfet page for PDP and PDK status.
Flexfet FAQ Category Index Top of Page
FleX FAQs
Q. What is FleX?
A. FleX is CMOS Silicon on Polymer (SOP). FleX is the result of a unique extreme
wafer thinning process that is capable of completely removing the handle silicon
of a SOI wafer, yielding fully functional, flexible wafers with a final silicon
thickness of less than 2000 Angstroms.
Q. Does FleX allow post thinning fab processing?
A. Yes. Many process steps can be applied to a FleX wafer post thinning.
Q. How do you make a wafer so thin?
A. You didn't really think we would answer that?
FleX FAQ Category Index Top of Page
Custom Fabrication FAQs
Q. What is Custom Fabrication?
A. Custom fabrication is our ability to put your existing process/product into our
fab or create a custom process/product specific to your needs.
Q. How do I install my process into your fab?
A. Through Copy Smart or Copy Exact methodologies. Typically a Copy Smart
methodology is used. Transferred processes are often from smaller wafer sizes
and older technology capabilities. We will apply enhancements based on 200mm
processing and current technology best practices. We will use our proven process
flows and incorporate our advanced capabilities and best practices to improve
yields and drive cost reductions.
Q. Can I develop custom process with American Semiconductor?
A. Yes. We will develop process steps, modules or flows to meet your
product/process design and performance requirements.
Q. Can I integrate novel materials and processes with American Semiconductor?
A. Yes. However, contamination and best practice requirements must be met.
Q. What is Copy Smart?
A. Copy Smart is a methodology to transfer existing products/processes into our
fab. Copy Smart utilizes existing process flows when possible, but also incorporates
improvements for current technology and best practices. When transferring from
older lines, improvements will be made for 200mm processing.
Q. What is Copy Exact?
A. Copy Exact is a methodology to transfer existing products/processes into our
fab. Copy Exact utilizes existing process flows exactly as they were run
previously.
Q. Which is better, Copy Smart or Copy Exact?
A. It depends on the situation. Copy Exact is useful when the same tools and
processes are available and no change in the product or process is desired. Copy
Smart is useful when applying product or process improvements, or when migrating
to more advanced technologies or larger wafer sizes.
Custom Fabrication FAQ Category Index Top of Page
Design Services FAQs
Q. What experience does the design team have?
Each member of the design has significant experience in the semiconductor
industry; several members with more than 20 years experience. Areas of expertise
include design, verification, physical layout, validation and applications of
micro-controllers.
Q. What is your design flow?
A. A flow using RTL to gate to physical layout is our standard digital design
flow. Analog and mixed signal designs are developed separately and modeled for
use during chip development and verification.
Q. Can you design with processes other than American Semiconductor's
Flexfet?
A. Yes. The team has extensive experience working with third party foundries
such as Tower, Jazz, UMC and TSMC.
Q. Can you provide a system development platform for my micro-controller?
A. Yes. If desired, an early software development platform using an FPGA can be
developed for your design. Additionally, a system development board can be developed
with specific peripherals for your application along with board support reference
software.
Q. What design services are available?
A. Our capabilities support a full turnkey solution, covering:
- foundry selection
- IP creation, acquisition, and integration
- design
- verification
- silicon validation and development boards
- FPGA emulation
- test
You can leverage any or all of these capabilities for your needs.
Custom Fabrication FAQ Category Index Top of Page