FleX™
Silicon on Polymer
FleX™ is a unique Silicon on Polymer technology. FleX is enabled by a unique wafer thinning process that is capable of completely removing the handle silicon of a SOI wafer. FleX delivers fully functional, flexible wafers with a final silicon thickness of <2000 angstroms. FleX allows post thinning fab processing.
FleX
Silicon on Polymer
<2000 Angstrom Silicon Thickness
SOI Processing
Handle silicon completely removed
Fully functional, flexible circuits
Post thinning fab processing available