FleX™ Silicon-on-Polymer is a revolutionary process for creating high-performance, single-crystaline CMOS with multi-layer metal interconnect on a flexible substrate. FleX enables a new generation of durable, pliable ICs that greately improves the ability to integrate CMOS functionality in flexible electronics. FleX delivers fully functional, flexible wafers with a final silicon thickness of <2000 angstroms. FleX can be applied to SOI processes from any foundry. FleX allows post thinning fab processing, enabling new capabilities for packaging and 3DIC integration.
FleX has been demonstrated both at the wafer scale as well as conformally mounted to an irregular surface. Test results of the same die as a full-thickness wafer and as a FleX wafer show little electrical shift with some parameters actually improving. The video below shows a FleX die tested while deformed.
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