FleX™

Silicon on Polymer

FleX™ is a unique Silicon on Polymer technology. FleX is enabled by a unique wafer thinning process that is capable of completely removing the handle silicon of a SOI wafer. FleX delivers fully functional, flexible wafers with a final silicon thickness of <2000 angstroms. FleX allows post thinning fab processing.

FleX
Silicon on Polymer

• <2000 Angstrom Silicon Thickness

• SOI Processing

• Handle silicon completely removed

• Fully functional, flexible circuits

• Post thinning fab processing available